Bosch has introduced a new generation of ultrasonic chipsets at Auto China in Beijing, designed to feed raw sensor data directly into AI-based parking and driver assistance systems. The TB193 and TB293 chipsets capture unprocessed signals at the sensor itself, giving downstream perception software a denser data set for object detection and distance measurement. The launch was announced via the Bosch press portal on April 24, 2026.
Highlights
- TB193 controller chip and TB293 sensor chip form a dual-chip architecture that captures raw ultrasonic signals at the source
- New VASI (Versatile Automotive Sensor Interface) bus is an open interface allowing automakers to mix sensor suppliers
- Data rate of 1.16 Mbps supports real-time fusion of ultrasonic, camera, and radar inputs
- Up to 50 percent lower energy consumption and up to 50 percent weight reduction versus comparable solutions
Raw data at the source
The seventh-generation chipsets shift ultrasonic perception away from pre-processed signal handling. The TB293 sits directly at the ultrasonic transducer and captures raw signals without intermediate processing steps. The TB193 controller chip coordinates multiple sensor chips and prepares the aggregated data for the central compute unit.
This approach gives AI-based parking assistants access to a richer signal set, which Bosch says is particularly useful in tight parking garages with pillars and walls, or when vehicles are parked close together. The system can also detect road conditions such as wet or varying surfaces, opening the door to features like context-aware braking decisions.
The architecture aligns with the industry’s shift toward centralized, software-defined vehicle platforms, with the dual-chip split intended to reduce wiring complexity at the vehicle level and support scalable sensor counts across vehicle classes.
Open interface and supplier flexibility
For the first time, Bosch is selling its ultrasonic ICs as standalone components rather than only inside complete sensor systems. The company is also introducing the VASI bus, an open interface that transmits both data and power on the same line.
“The seventh generation of our ultrasonic chips captures sensor data with the highest precision and speed – exactly what AI-powered parking assistants need,” said Axel Kaschner, Senior Vice President of the Business Unit Integrated Circuits at Bosch Mobility Electronics.
The open-interface approach gives vehicle manufacturers more flexibility in choosing sensor suppliers, a notable shift for a Tier 1 that has historically packaged its ultrasonic technology in turnkey systems. The move parallels Bosch’s broader strategy of offering its in-house automotive silicon to outside customers, which the company has expanded across radar and ADAS computing in recent years.
Bandwidth, power, and packaging
The 1.16 Mbps data rate is the headline technical specification. Bosch said the throughput is necessary to move raw ultrasonic data in real time without losing information between the sensor and the central processing unit. This bandwidth supports data fusion across ultrasonic, camera, and radar inputs, and it provides a substrate for AI algorithms that work directly on unprocessed signals.
“Our solution provides the original, unprocessed sensor signals. This ensures that all relevant information is available to be evaluated flexibly and used for various functions,” said Hendrik Seidel, Head of the ADAS business unit at Mobility Electronics.
On the efficiency side, Bosch reported up to 50 percent lower power consumption than comparable solutions, with reduced peripheral component counts and pin requirements. The VASI bus carries data and power together, cutting cabling weight by up to 50 percent. The chipsets also carry a 150°C (approximately 300°F) temperature rating for installation in engine-adjacent locations.
Path to higher automation
Bosch positioned the chipsets as a building block for the journey toward higher levels of vehicle automation, with the same hardware architecture intended to scale from current parking assistance into fully automated driving functions over time.
“The combination of complete raw data, high transmission speed, energy efficiency, and open interface enables vehicle manufacturers to develop the assistance systems today that will grow into fully automated driving functions in the future,” Kaschner said.
The launch follows Bosch’s separate Auto China announcement of progress on Level 3 highly automated driving, reinforcing the supplier’s positioning around the China ADAS market.
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