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Aeva Technologies, Inc., a pioneer in advanced sensing and perception systems, has announced a strategic collaboration with a technology affiliate of a Global Fortune 500 company. This partnership aims to integrate Aeva’s cutting-edge 4D LiDAR technology into new industrial and consumer markets, while also selecting the affiliate as a Tier-2 manufacturing partner for a major passenger OEM program. The collaboration includes an investment of up to $50 million, with the partner acquiring a 6% equity stake in Aeva.
Key Highlights
- Aeva teams up with a leading global technology provider to expand 4D LiDAR applications.
- Investment of up to $50 million to support production and joint product development.
- Partner secures 6% equity stake in Aeva, strengthening financial ties.
- Collaboration targets automotive, industrial, and consumer electronics markets.
- Aeva’s FMCW technology drives high-performance, reliable sensing solutions.
The partnership leverages Aeva’s proprietary Frequency Modulated Continuous Wave (FMCW) technology, which enables 4D LiDAR sensors to detect instant velocity alongside 3D positioning. This capability enhances the decision-making accuracy of autonomous systems in vehicles, robotics, and consumer devices. By combining Aeva’s innovation with the partner’s expertise in global manufacturing and electronics, the collaboration seeks to accelerate the adoption of next-generation sensing solutions across diverse sectors.
Soroush Salehian, Aeva’s Co-founder and CEO, emphasized the partnership’s significance, stating, “This collaboration validates the strength of our unique technology and underscores the growing demand for reliable perception solutions.” The investment will fund expanded production capacity and new product development, enabling Aeva to enter markets like consumer electronics and industrial robotics with minimal shareholder dilution.
Further details on this strategic alliance will be shared in the coming months. Aeva continues to transform autonomy by integrating all key LiDAR components into a compact silicon photonics chip, delivering groundbreaking solutions for a wide range of applications.
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